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Experienced Package Product Engineer

Dresden💼 Full-time🗓 2026-06-25 → 2026-07-30

Core

Lead technical work to ramp customer products from prototyping to production, serving as a liaison between concept and manufacturing phases.

Role type

Senior IC package product engineer

Builds

Semiconductor packaging solutions and production processes for automotive and aerospace/defense customers

Domain

Semiconductor manufacturing / Packaging technology

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Semiconductor engineering design, packaging technology, process technology, risk evaluation, change management, supplier coordination, production issue resolution, IC design support, Wafer Sort, Final Test, data analytics, AI/ML, outlier screening

Preferred skills

RF experience, advanced data analytics, AI/ML, outlier screening

Technologies

AI/ML, outlier screening

Responsibilities

Develop new products from concept to production release, evaluate product requirements and identify risks, review product and process designs, participate in change management, work with suppliers to ensure quality, resolve production issues, provide technical support for IC design and testing, research advanced data analytics for reliability

Seniority

Senior, hands-on IC

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