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Lead Integrator - NextGenFDX

Dresden💼 Full-time🗓 2026-06-05 → 2026-07-30

Core

Lead the development of a process flow for the Next-Generation FDSOI node, guiding a team of Process Integrators to deliver industry-leading performance for ULP CMOS technology.

Role type

Technology Development Lead (Process Integration)

Builds

Next-Generation FDSOI node technology features for volume production

Domain

Semiconductor manufacturing / Advanced CMOS process integration

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

CMOS process integration, CVD, lithography, RIE, Test Chip Design, Technology-Design Interactions, statistics, data analysis

Preferred skills

PhD in relevant technical discipline, German language proficiency

Technologies

CVD, lithography, RIE

Responsibilities

Physical and electrical characterization of advanced semiconductor features, Design and analysis of experiments to improve performance parameters, Coordinate technology development tasks in volume production infrastructure, Collaborate in cross-functional teams to solve technology challenges, Network with research institutes to bridge scientific research into industry applications, Define and run technical feasibility studies

Seniority

Senior, hands-on IC

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