SMTS Device Modeling & Characterization
Core
Develops compact (SPICE) models for FDSOI, FinFET, Bulk MOSFET, MRAM, and RRAM technologies to support Process Design Kits (PDKs) for Digital/Analog and RF chip design.
Role type
Senior IC device modeling engineer (strategic/mentorship)
Builds
Production SPICE models and statistical models for semiconductor process nodes
Domain
Semiconductor manufacturing / Device Physics / Compact Modeling
Deliverable
production ML models | product features
Required skills
MOSFET device physics, FDSOI modeling, FinFET modeling, compact model extraction, test structure design, statistical modeling (Monte Carlo, mismatch, fixed corner), model-to-HW correlation analysis
Preferred skills
BSIM families knowledge, model extraction tools (MBP/ICCAP), high frequency (RF) characterization, process development experience, measurements & characterization
Technologies
SPICE, BSIM, MBP, ICCAP
Responsibilities
Design MOSFET characterization structures for compact model extraction, Develop Compact models for FDSOI, FinFET and Bulk technologies, Develop statistical (Montecarlo, Mismatch and fixed corner) models, Deliver Model-to-HW correlation reports, K, CpK Analysis, Coaches and mentors team members, Initiates projects with suppliers in a very complex environment
Seniority
Senior, hands-on IC with strategic leadership
