Device Modeling Engineer
Core
Extract and optimize compact (SPICE) models for next-generation semiconductor devices and develop AI/ML-enhanced parameter extraction methodologies.
Role type
Device Modeling Engineer (SPICE)
Builds
Compact models for advanced semiconductor devices (MOS, LDMOS, DEMOS, BJT, Passives, GaN, RF, Sensors, NVM, RAM)
Domain
Semiconductor physics and circuit design
Deliverable
production ML models
Required skills
Compact model formulation, parameter extraction, semiconductor device physics, circuit analysis, EDA tool usage, SPICE simulation, Verilog-A, MATLAB/Python programming, statistical analysis of large datasets
Preferred skills
AI/ML expertise, TCAD experience, expert-level knowledge of BSIM/MEXTRAM/HICUM/MVSG-GAN/ASM models, ICCAP/BSIMPROPLUS/MBP tools, Cadence EDA suite, Spectre simulator
Technologies
MATLAB, Python, Verilog-A, ICCAP, BSIMPROPLUS, MBP, Cadence, Spectre, TCAD
Responsibilities
Extract compact models for advanced semiconductor devices, partner with designers to deploy modeling solutions, develop innovative model formulations for emerging technologies, automate modeling infrastructure, validate models through measurement and analysis
Seniority
Senior, hands-on IC
