CareerPlan

Werkstudent*in im Bereich Tape-Out Engineering

DEU - Saxony - DresdenRemoteFull-time2026-07-06 → 2026-11-09
Hybrid

Core

Generating precise photomask data from complex physical IC designs to enable reliable chip production.

Role type

Student Tape-Out Operations Engineer

Builds

Photomask data for semiconductor manufacturing

Domain

Semiconductor manufacturing / IC Design

Required skills

Submicron IC design, EDA tools (Calibre DRC/LVS, Cadence Virtuoso), Scripting (TCL, Python, Perl Shell), Linux/UNIX environment, Microsoft Office suite

Preferred skills

Experience with Tape-Out logistics and integration

Technologies

Calibre, Cadence Virtuoso, TCL, Python, Perl, Linux

Responsibilities

Participate in developing future Tape-Out systems, perform daily Tape-Out operations (DRC, Dataprep), collaborate with Fabs and OPC teams to ensure clean Tape-Outs, develop and implement process improvement methods, document best practices and training materials, evaluate failure modes and risk mitigation measures

Seniority

Student (Werkstudent)