Field Application Engineer - Physical Design
Core
Provide close support to customers and resolve challenges in RTL-to-GDS implementation flows for advanced process chips.
Role type
Field Application Engineer (Physical Design)
Builds
IP hardening and implementation flows for next-gen chips
Domain
Semiconductor physical design and implementation
Required skills
RTL2GDS implementation flow, advanced process tape-out experience, Cadence/Synopsys tools, TCL/Python/Perl scripting, signoff STA/LVS/DRC flows, customer interfacing
Preferred skills
Signoff STA/LVS/DRC flows, customer interfacing experience
Technologies
Cadence, Synopsys
Responsibilities
Provide close support to customers and resolve any challenges, Provide training to customers on tools and present technology, Work on full Implementation and Signoff flow for IP hardening, Provide continuous feedback to R&D to improve product
Seniority
Mid-Senior, hands-on IC
