CareerPlan

ASIC Physical design Lead

Hyderabad, IndiaFull-time2026-10-09 → 2026-10-22

Core

Plan, implement, and execute physical design and verification of processing subsystems IP to meet tapeout signoff criteria.

Role type

Senior IC ASIC Physical Design Lead

Builds

Processing subsystems IP for next-gen processors

Domain

Semiconductor / Digital IC Design

Required skills

Block-level and top-level physical implementation, low-power design, processor architecture, EDA tools (Innovus, Fusion Compiler, PrimeTime), scripting (Perl, Ruby, Makefile, shell), lower node technology (5nm or below)

Preferred skills

Leadership or mentorship experience

Technologies

Innovus, Fusion Compiler, PrimeTime, Perl, Ruby, Makefile, shell

Responsibilities

Plan and execute physical design flow, perform verification to meet signoff criteria, collaborate with cross-timezone engineering teams

Seniority

Senior, hands-on IC