Senior IC Packaging Process Engineer
Core
Lead adhesive and bonding process development for advanced FCBGA packaging, including surface preparation, coatings, and process optimization for optical alignment and high dimensional stability.
Role type
Senior IC packaging process engineer (semiconductor)
Builds
Advanced ASIC packages (FCBGA) for NVIDIA
Domain
Semiconductor manufacturing / Materials Science
Required skills
Adhesive process development, Design of Experiments (DOE), Failure analysis (cross-sectioning, SEM/EDX, optical microscopy, DSC, TGA, FTIR), Material qualification (adhesives, encapsulants, underfills), Statistical Process Control (SPC), Yield improvement analysis
Preferred skills
Semiconductor manufacturing processes, Optical systems
Technologies
FCBGA, OSAT manufacturing sites
Responsibilities
Lead adhesive and bonding process development for advanced FCBGA packaging; Design and execute Design of Experiments (DOE) for adhesive material qualification and process optimization; Evaluate and qualify new materials from vendors; Define incoming material acceptance criteria and SPC thresholds; Collaborate with suppliers to resolve process escapes and drive 8D corrective actions; Monitor and analyze production data to identify trends and drive yield improvements.
Seniority
Senior, hands-on IC
