Principal Photonics IC Design Engineer
Core
Technical lead owning the photonics integrated circuit (PIC) product from architecture definition through production tapeout and silicon validation for co-packaged optical interconnects powering AI supercomputers.
Role type
Principal IC Design Engineer (Silicon Photonics)
Builds
Co-packaged optical interconnects (PICs) for high-speed datacom/telecom and AI supercomputing
Domain
Semiconductor / Silicon Photonics / Optical Interconnects
Required skills
Silicon photonics IC design, Cadence Virtuoso (Virtuoso, PCell, SKILL), photonic device physics (waveguides, modulators, photodetectors), tapeout management, cross-functional technical leadership, design automation
Preferred skills
High-speed (>50 Gbaud) optical modulator/receiver design, DWDM architectures, co-packaged optics (CPO) integration, electromagnetic solvers (FDTD, FDE, EME), publication/patent record
Technologies
Cadence Virtuoso, SKILL, Ansys Lumerical, ZeMax, MATLAB, Python, Verilog-A
Responsibilities
Own end-to-end PIC product delivery (architecture, design, layout, verification, tapeout, validation), lead cross-functional execution across device/packaging/systems teams, drive tapeout schedules and resolve critical path issues, architect optical transceiver PICs, define/improve design methodology and verification flows, mentor photonics designers and set technical roadmap
Seniority
Principal, technical lead & mentorship
