Principal Thermal Mechanical Photonic Designer
Core
Designing thermal and structural solutions for Silicon Photonic chips and electronic packages to ensure reliability under stress and thermal conditions.
Role type
Principal Thermal Mechanical Photonic Designer (IC)
Builds
High-speed chip interfaces (NVLink, PCIe, USB) and Silicon Photonics ICs for supercomputers, gaming consoles, and self-driving cars.
Domain
Semiconductor / Silicon Photonics / Thermal & Structural Engineering
Required skills
Thermo-mechanical modeling, Stress simulation, Solder joint fatigue/creep modeling, Crack propagation analysis, Hygroscopic stress analysis, Wire-bonding/fusing simulation, Thermal characterization, Ansys tools proficiency, Optical component design, Cross-functional collaboration
Preferred skills
None explicitly stated beyond required experience
Technologies
Ansys, JEDEC standards
Responsibilities
Run stress simulation in optical components and fiber alignment; Set up experimental methodology for thermal validation; Model Si die-package thermo-mechanical interactions; Analyze solder joint fatigue and creep; Predict failures during assembly and reliability tests; Craft thermal specification datasheets based on FE and experiments.
Seniority
Principal, hands-on IC