Dicing Specialist, Silicon Assembly (Starlink)
Core
Operate and program advanced dicing equipment (diamond saws, laser dicers, plasma dicers) to process silicon wafers and large-format panels for the Starlink satellite constellation.
Role type
Hands-on IC packaging and assembly specialist
Builds
Integrated circuit packaging and assembly for Starlink satellites
Domain
Semiconductor manufacturing / Space technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Equipment operation and programming, process parameter optimization, in-process inspection, equipment troubleshooting, cleanroom protocols, data reporting
Preferred skills
Silicon wafer dicing experience, heterogeneous integration knowledge, lean manufacturing, root cause analysis, automation familiarity
Technologies
Diamond saws, laser dicers, plasma dicers, optical microscopes, die shear testers, particle counters, SPC software
Responsibilities
Operate and program dicing equipment, develop and refine dicing recipes, perform in-process and post-dicing inspections, troubleshoot equipment issues, maintain cleanroom protocols, document dicing data and generate reports
Seniority
Mid-level, hands-on IC