EEE Failure Analysis Engineer (Starlink)
Core
Analyze failures in semiconductor packages, devices, and PCBA using destructive and non-destructive techniques to support product life-cycle quality and manufacturing process improvement.
Role type
Senior IC failure analysis engineer (semiconductor/PCBA)
Builds
Pre-production, qualification, and flight hardware for Starlink satellite constellation
Domain
Aerospace / Semiconductor reliability
Required skills
Destructive analysis (cross-section, lapping, decapsulation), Non-destructive analysis (X-Ray, CT, SEM, CSAM, OBIRCH, FIB), Semiconductor/package reliability, PCBA manufacturing knowledge, Electrical troubleshooting, Mechanical discipline
Preferred skills
Advanced degree in Material Science, 7+ years in semiconductor reliability, Independent problem solving, Electrical theory understanding
Technologies
X-Ray, CT scan, SEM, CSAM, OBIRCH, FIB, Cross Section, Parallel Lapping, Chemical decapsulation
Responsibilities
Perform destructive and non-destructive failure analysis on semiconductor packages and devices, Investigate non-conforming material and piece part failures, Support rework and recovery efforts on non-conforming hardware, Assist with First Article Inspection Reports, Provide surge support for critical qualification test efforts
Seniority
Senior, hands-on IC
