Panel Packaging Technology Enablement Director
Core
Leads the development and validation of panel process solutions for AI accelerators and high-performance computing, spanning core substrate formation through build-up and interconnect.
Role type
Director, Panel Packaging Technology Enablement
Builds
Panel-level packaging solutions for AI and HPC
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Advanced packaging integration (2.5D/3D, fan-out, build-up), process development (PVD, plating, etch, lithography), DOE and statistical analysis, team leadership, customer negotiation, patent generation
Preferred skills
Panel-format processing (glass core, TGV, fine-line RDL), AI accelerator/HPC architecture knowledge, Asia-Pacific ecosystem relationships, JDA management
Technologies
PVD, plating, etch, lithography, dielectric processes, through-glass vias, fine-line RDL
Responsibilities
Define and execute panel technology enablement roadmap; lead complex integration programs from concept to customer transfer; serve as primary technical lead for strategic customers; build and manage strategic partnerships with ecosystem partners; lead and develop a multidisciplinary engineering team
Seniority
Director, strategic leadership & team management
