College Intern - Process & product development in PVD chambers in Hybrid bonding for SOIC (advanced packaging)
Core
Intern supporting engineers in optimizing PVD processes, measuring metal film properties, and troubleshooting process engineering issues for advanced semiconductor packaging.
Role type
Intern, process & product development
Builds
PVD chambers and hybrid bonding solutions for SOIC (advanced packaging)
Domain
Semiconductor manufacturing / Materials science
Required skills
PVD process optimization, metal film property measurement, hardware characterization, Root Cause Analysis, data collection and analysis, troubleshooting moderately complex problems
Preferred skills
None stated
Technologies
PVD chambers, hybrid bonding systems
Responsibilities
Optimize PVD processes and measure metal film properties; Perform hardware characterization on moderately difficult systems; Troubleshoot moderately complex process engineering issues with engineer guidance
Seniority
Intern