Staff Engineer Simulation and Package Design Methodology (f/m/div)
Core
Develop and support simulation methodologies, design flows, and tool environments for Chip-Package-Board (CPB) Co-Design and advanced package development in Linux-based HPC environments.
Role type
Staff Engineer, Simulation and Package Design Methodology
Builds
Simulation-driven design and verification for advanced packaging technologies including System-in-Package (SiP), heterogeneous integration, and 2.5D/3D package solutions
Domain
Semiconductor industry, advanced packaging, electromagnetic/thermal/multiphysics simulation
Deliverable
production ML models
Required skills
Electromagnetic/thermal/multiphysics simulation, EDA environments, Linux, Python, automation, design flows, tool development (via careerplan.io/jobs/7891318-staff-engineer-simulation-and-package-design-methodology-fmdiv-at-infineon-technologies-au)
Preferred skills
Machine Learning (ML) and Artificial Intelligence (AI) tools for design or simulation
Technologies
Synopsys, Ansys, Cadence, Siemens, Keysight, COMSOL
Responsibilities
Drive and continuously improve methodologies for electromagnetic, thermal and multiphysics analysis; Own and maintain the simulation environment within the CPB Co-Design Flow & Methodology team; Enable simulation-driven design and verification for advanced packaging technologies; Collaborate with Business Lines, Design Systems, package development teams, and external technology partners; Drive technology evaluations, benchmarks, automation initiatives, and knowledge sharing activities
Seniority
Staff, hands-on IC with strategic influence
