Staff Engineer Simulation and Package Design Methodology (f/m/div)
Core
Develop and support simulation methodologies, design flows, and tool environments for Chip-Package-Board (CPB) Co-Design and advanced package development in Linux-based HPC environments.
Role type
Staff Engineer, Simulation and Package Design Methodology
Builds
Simulation-driven design and verification for advanced packaging technologies including System-in-Package (SiP), heterogeneous integration, and 2.5D/3D package solutions.
Domain
Semiconductor industry, advanced packaging, multiphysics simulation
Required skills
Electromagnetic, thermal, and multiphysics simulation; Chip-Package-Board (CPB) Co-Design; Linux environment; Python, bash, MATLAB, or Perl; EDA tool environments (Synopsys, Ansys, Cadence, Siemens, Keysight, COMSOL); Technology evaluation and benchmarking; Automation initiatives.
Preferred skills
Machine Learning (ML) and Artificial Intelligence (AI) tools for design or simulation.
Technologies
Synopsys, Ansys, Cadence, Siemens, Keysight, COMSOL, Linux, Python, bash, MATLAB, Perl.
Responsibilities
Develop simulation methodologies and design flows for CPB Co-Design; Drive electromagnetic, thermal, and multiphysics analysis; Own and maintain the simulation environment; Enable simulation-driven design for advanced packaging; Collaborate with Business Lines and external partners; Drive technology evaluations and automation initiatives.
Seniority
Staff, hands-on IC with strategic influence
