MTS - Thermal Simulation Engineer
Core
Lead high-fidelity thermal and thermo-mechanical modeling for next-generation High Bandwidth Memory (HBM) packages and 2.5D/3D semiconductor systems.
Role type
Senior IC Thermal Simulation Engineer (Semiconductor Packaging)
Builds
High Bandwidth Memory (HBM) solutions for AI and high-performance computing systems
Domain
Semiconductor industry / Thermal & Multiphysics Simulation
Deliverable
production ML models
Required skills
Multiphysics simulation (thermal, structural, coupled), Finite Element Modeling (FEM), Heat transfer analysis, Thermo-mechanical behavior analysis, Model validation & silicon correlation, Technical leadership, AI-enabled workflow integration
Preferred skills
Semiconductor packaging knowledge (HBM, TSVs, hybrid bonding), Material characterization, CFD/flow-based simulation, Scripting (Python, MATLAB, JMP)
Technologies
Ansys, Abaqus, Fluent, Star-CCM+, FloTHERM
Responsibilities
Lead development of high-fidelity thermal and thermo-mechanical models for HBM packages; Define and implement multiphysics simulation strategies; Provide deep technical analysis of thermal transport and heat flux; Lead simulation-to-silicon correlation with characterization teams; Assess material properties and layout effects to identify thermal resistance drivers; Influence design and process teams with simulation results; Advance modeling methodologies and mentor engineers.
Seniority
Senior, hands-on IC
