Principal Characterization-Failure Analysis Engineer
Core
Thermomechanical characterization of sub-assemblies and silicon dies, plus failure analysis and debugging of opto-mechanical assembly processes.
Role type
Principal Characterization-Failure Analysis Engineer
Builds
Silicon photonics sub-assemblies and dies for utility-scale quantum computers
Domain
Quantum computing / Silicon photonics / Semiconductor packaging
Required skills
root cause analysis (fishbone, 8D), FMEA, data processing (Python, MATLAB, JMP), semiconductor assembly testing, photonics sub-assembly inspection, mechanical vibration analysis, thermography, mechanical load testing
Preferred skills
photonics experience, electrical engineering background
Technologies
Python, MATLAB, JMP, AOI, wire-bonding, flip chip, underfill
Responsibilities
Diagnose failures using root cause analysis tools; perform failure mode and effects analysis (FMEA); process characterization data; manage short deadlines in a fast-paced environment
Seniority
Principal, technical leadership