工艺&可靠性工程师-服务器研发
Core
Develop board-level process solutions and reliability designs for server and chip projects, including DFM/DFR, packaging engineering, and new material/process validation.
Role type
Senior IC process & reliability engineer (server/chip packaging)
Builds
Server boards, AI accelerator cards, and chip packaging solutions
Domain
Semiconductor manufacturing / Server hardware
Required skills
PCB process design, SMT and wave soldering, chip packaging warpage simulation, board-level stress analysis, thermal cycling simulation, failure analysis, new material/process validation
Preferred skills
Experience with dummy board validation, cross-functional collaboration
Technologies
Warpage Simulation, SMT, Wave Soldering, Thermal Cycling
Responsibilities
Design board-level process solutions and DFM/DFR for server and chip projects; Collaborate with packaging teams on chip packaging design and board-level verification; Pre-research and validate new materials and processes for single-board assembly; Perform failure analysis on production and field issues.
