【Gunma】Semiconductor Assembly Mass Production Engineer
Core
Lead Assembly Process Engineer for FCBGA/WLCSP packages, responsible for assembly engineering from development through mass production at domestic and overseas sites.
Role type
Senior IC assembly process engineer (semiconductor back-end)
Builds
Flip-chip packages (FCBGA, WLCSP, Chiplet) for automotive and embedded semiconductor solutions
Domain
Semiconductor manufacturing (back-end assembly)
Required skills
FCBGA assembly process knowledge, WLCSP assembly process knowledge, yield improvement, quality improvement, cost reduction, root cause analysis, corrective action development, coordination with OSATs, Japanese business communication, English conversational communication
Preferred skills
Chiplet package technology experience, hands-on troubleshooting for assembly processes, experience with R-CAR series products
Technologies
FCBGA, WLCSP, R-CAR series, Chiplet packages
Responsibilities
Technical verification and review of development results, manage assembly yield/cost/quality improvement, coordinate product/process changes, develop root cause and corrective actions for issues, support customers
Seniority
Senior, hands-on IC
