Sr Manager, Packaging Assembly Operation
Core
Design, qualify, and sustain assembly processes for Power QFN packages and Cu Clip thin die assembly for Smart Power Stage products.
Role type
Senior Manager, Packaging Assembly Operation
Builds
PQFN packages and associated modules for automotive, industrial, infrastructure, and IoT applications
Domain
Semiconductor packaging and assembly
Required skills
Assembly engineering, process engineering, package development, thin wafer handling, SPS solder attach, wire bonding, quality/reliability requirements, SPC, statistical analysis
Preferred skills
Cu Clip, Thin Die, Power QFN, Package development, Development-to-Production transfer, NPI-to-Mass Production support, Ultra-thin wafer handling, Taiko wafer technology
Responsibilities
Design package and develop processes to qualify PQFN packages, ramp up manufacturing volume and qualify sources, manage line sustaining to improve yield/capacity/quality/costs, address customer feedback with cross-functional teams, manage Product Lifecycle Management documents, conduct change-management with suppliers, partner with Quality and Reliability teams, serve as manufacturing engineering interface for NPI-to-production transfers, manage OSAT and contract manufacturing relationships
Seniority
Senior, hands-on IC with management responsibilities
