Engineer (Back End Assembly Line)
Core
Develop, optimize, and qualify robust semiconductor assembly processes for REXFET products, specifically covering Resin Tie Bar Cut, Strip Grinding, and Cut Form Mark processes to ensure manufacturing readiness.
Role type
Senior IC process engineering specialist (semiconductor assembly)
Builds
REXFET semiconductor products
Domain
Semiconductor manufacturing / Power discrete packaging
Required skills
Semiconductor assembly process development, DOE, SPC, process capability analysis, FMEA, root cause analysis, technical reporting, cross-functional collaboration
Preferred skills
Power semiconductor packaging experience, JMP analysis tools, machine vision inspection, dieset maintenance, process transfer, mass production ramp-up
Technologies
JMP, Microsoft Excel, Microsoft PowerPoint
Responsibilities
Develop and optimize assembly process conditions for new REXFET products; Prepare and execute process development plans and qualification builds; Establish process parameters, specifications, and control limits; Collaborate with Production, Equipment Eng, QA, and other teams; Prepare and maintain process specifications, SOPs, and risk assessments.
Seniority
Senior, hands-on IC
