NPI Senior Process Engineer
Core
Develop, optimize, and qualify semiconductor assembly processes (Molding, IR Reflow, Plating) to ensure new products meet quality, reliability, and manufacturing readiness requirements.
Role type
Senior IC NPI Process Engineer (Semiconductor Assembly)
Builds
New semiconductor packages (Molding, Reflow, Plating) for mass production
Domain
Semiconductor manufacturing / Power semiconductor packaging
Required skills
Semiconductor assembly process development, DOE, SPC, FMEA, root cause analysis, process capability analysis, technical reporting, cross-functional collaboration
Preferred skills
Power semiconductor/package assembly experience, Towa molding/plating machine operation, solder joint/void/X-ray/failure analysis, JMP analysis tools
Technologies
JMP, Microsoft Excel, Microsoft PowerPoint
Responsibilities
Develop and optimize Molding, IR Reflow, and Plating process parameters; Execute process validation and qualification builds; Collaborate with cross-functional teams for product introduction; Prepare process documentation, SOPs, and risk assessments; Support mass production transfer and troubleshooting.
Seniority
Senior, hands-on IC
