Engineer (Middle Assembly Line)
Core
Develop, optimize, and qualify robust semiconductor assembly processes for Molding, IR Reflow, and Plating to ensure new products meet quality, reliability, and cost requirements.
Role type
Middle Assembly Line Engineer (Semiconductor Packaging)
Builds
Semiconductor packages (Molding, Reflow, Plating)
Domain
Semiconductor manufacturing / Power electronics
Required skills
Semiconductor assembly process development, DOE, SPC, FMEA, root cause analysis, process capability analysis, technical documentation, cross-functional collaboration
Preferred skills
Power semiconductor packaging experience, Towa molding/plating machine operation, solder joint/void/X-ray analysis, JMP analysis tools
Technologies
JMP, Microsoft Excel, Microsoft PowerPoint
Responsibilities
Develop and optimize Molding, IR Reflow, and Plating process parameters; Execute engineering and qualification builds; Collaborate with Production, Equipment, QA, and Product Engineering teams; Prepare process specifications, SOPs, and risk assessments; Support mass production transfer and troubleshooting.
Seniority
Mid-level, hands-on IC
