Engineer (Front Assembly Line)
Core
Develop, optimize, and qualify robust semiconductor assembly processes for packages from wafer preparation to final cleaning to ensure quality, reliability, and productivity.
Role type
Senior IC process engineer (semiconductor assembly)
Builds
Engineering and qualification builds for new semiconductor packages
Domain
Semiconductor manufacturing / Power electronics
Required skills
DOE, SPC, process capability analysis, FMEA, root cause analysis, technical reporting, cross-functional collaboration
Preferred skills
Power semiconductor packaging, Taiko wafer handling, solder joint inspection, void analysis, X-ray inspection, package failure analysis
Technologies
Wafer mounting, wafer dicing, solder printing, die bonding, clip bonding, vacuum reflow, flux cleaning
Responsibilities
Develop and optimize assembly process conditions; Execute process development plans and validation; Collaborate with production, equipment, and quality teams; Prepare process specifications, SOPs, and risk assessments; Support safe launch and mass production transfer
Seniority
Mid-to-Senior, hands-on IC
