半導体組立工程 技術開発エンジニア
Core
Lead semiconductor package development projects for automotive and IoT applications, focusing on high-reliability packaging, new material/process implementation, and production line ramp-up.
Role type
Senior IC semiconductor package development engineer
Builds
High-reliability semiconductor packages for automotive and IoT markets
Domain
Semiconductor manufacturing / Automotive electronics / IoT
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor back-end assembly/packaging development, Reliability testing evaluation, Process improvement, Quality management, Technical degree (Mechanical/Materials/Electronics/Chemical)
Preferred skills
Semiconductor package material development, Process technology setup, LF/BGA substrate design, CAD drafting, ISO/IATF compliance
Technologies
CAD, LF, BGA
Responsibilities
Lead new product development projects, Provide technical support and reporting for project development, Support manufacturing line setup and mass production transition, Drive quality and yield improvement activities, Support technical development for new materials and processes, Coordinate technical projects with overseas sites
Seniority
Senior, hands-on IC
