Staff Process Engineer
Core
Design and qualify PQFN packages and develop assembly processes for SPS (Smart Power Stage) products and modules.
Role type
Staff Process Engineer (Package Development & Assembly)
Builds
PQFN packages, SPS modules, and associated assembly processes
Domain
Semiconductor manufacturing, Power electronics
Required skills
Process engineering, Package development, Thin wafer handling, SPS solder attach, Line sustaining, Yield improvement, Change management, Supplier management, NPI-to-production transfer, OSAT/contract manufacturing relations
Preferred skills
Cu Clip, Thin Die, Taiko wafer experience, Ultra-thin wafer handling expertise
Technologies
JMP, SPC software
Responsibilities
Design package and develop processes to qualify PQFN packages for SPS products; Ramp up manufacturing volume and qualify required sources; Improve assembly yield, capacity, quality, and costs; Address customer feedback collaborating with Test, Product Engineers, Quality & Operations; Manage Product Lifecycle Management documents; Conduct change-management with suppliers; Partner with Quality and Reliability teams; Serve as key manufacturing engineering interface for NPI-to-production transfers; Manage OSAT and contract manufacturing relationships
Seniority
Staff, hands-on IC with strategic oversight
