Package Design Engineering - Director
Core
Lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies supporting AI/data center power applications.
Role type
Director of Semiconductor IC Packaging Assembly Engineering
Builds
Scalable high-volume manufacturing for Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages using WBG technologies (SiC, GaN).
Domain
Semiconductor manufacturing, power electronics, advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work -> physical/clinical work (manufacturing execution)
Required skills
Semiconductor package assembly processes (wirebond, flip chip, molding, SMT), yield analysis, SPC, DOE, root-cause analysis, OSAT partner management, NPI-to-HVM ramp execution, process change management, team leadership
Preferred skills
Advanced packaging (2.5D/3D, SiP, fan-out, embedded die), wide-bandgap product manufacturing, global manufacturing operations management, reliability standards (JEDEC, IPC)
Technologies
SiC, GaN, DBC, AMB, wirebond, flip chip, wafer-level packaging, multi-chip modules, SMT
Responsibilities
Lead sustaining engineering across assembly technologies; drive HVM performance in yield, cycle time, and quality; manage global OSAT relationships; execute NPI-to-production transfers; build and develop global assembly engineering teams
Seniority
Director, strategic leadership & global operations
