Engineer, Component (DPA)
Core
Lead and perform advanced Destructive Physical Analysis (DPA) on integrated circuits, components, and electronic devices to identify defects and assess reliability risks in high-reliability applications.
Role type
Senior DPA Engineer (Failure Analysis)
Builds
Reliability assessments and root cause investigations for defense and high-reliability clients
Domain
Defense electronics / Semiconductor reliability / Failure analysis
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
DPA investigations per MIL-STD methods, optical/digital microscopy, SEM/EDS, X-ray analysis, cross-sectioning, chemical/plasma etching, hermeticity testing, test plan design, technical reporting, mentorship
Preferred skills
BS in Electrical/Materials/Chemical Engineering, failure analysis, semiconductor packaging, electronics reliability, device physics, IC design, LabView, GDS layout
Technologies
MIL-STD-883, MIL-STD-750, MIL-STD-1580, ISO, JEDEC, AEC, IPC, LabView, GDS layout
Responsibilities
Lead DPA investigations to identify defects, perform advanced analysis using microscopy and X-ray, conduct cross-sectioning and etching, design test plans for reliability assessments, develop new analysis techniques, generate technical reports, provide technical guidance and mentorship, ensure compliance with industry standards
Seniority
Senior, hands-on IC
