Failure Analysis Engineer, Microelectronics (Starlink)
Core
Perform detailed root cause failure analysis on microelectronic components and packaging to support high-volume manufacturing, qualification, and field returns for Starlink satellites and user terminals.
Role type
Failure Analysis Engineer (Microelectronics)
Builds
Reliability of satellite constellation and user terminals
Domain
Aerospace / Microelectronics / Semiconductor Physics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
root cause failure analysis, electrical fault isolation, physical failure analysis, physics-of-failure principles, semiconductor failure modes knowledge, corrective action implementation, technical reporting, workflow development
Preferred skills
advanced FA tools proficiency (SEM, FIB, EDS, cross-sectioning), electrical characterization techniques, JEDEC and AEC reliability standards, data analysis with Python or JMP
Technologies
SEM, FIB, EDS, SAM, Lock-in Thermography, OBIRCH, EBIRCH, EBAC, nanoprobing, Python, JMP
Responsibilities
Own end-to-end root cause failure analysis investigations from characterization to corrective action verification, conduct advanced electrical fault isolation and characterization, perform advanced physical failure analysis, apply physics-of-failure principles to determine root causes, drive corrective actions with design and manufacturing teams, author detailed technical reports, develop and improve failure analysis techniques and workflows
Seniority
Mid-level, hands-on IC