芯片产品工程师（北京）
Core
Drive mass production ramp-up for chip products, managing packaging/test outsourcing strategies, engineering sample delivery, and yield improvement.
Role type
Chip Product Engineer (NPI & Yield)
Builds
Chip products (packaging and testing)
Domain
Semiconductor manufacturing / Chip packaging
Required skills
NPI process management, yield analysis, statistical data analysis, failure analysis (SEM/X-Ray/EMMI/SAT), reliability testing (ESD/Latch-up/HTOL), tooling preparation, supply chain coordination
Preferred skills
2.5D/3D packaging experience, wafer fab experience
Technologies
SEM, X-Ray, EMMI, SAT, ESD, Latch-up, HTOL
Responsibilities
Coordinate packaging and test outsourcing strategies; Prepare tooling and manage engineering sample delivery; Validate chip performance and confirm yield; Analyze yield data to identify and resolve key factors affecting yield; Troubleshoot production anomalies and implement corrective actions.
