Staff Process Engineer, Packaging
Core
Operate, program, and troubleshoot complex packaging equipment to build quantum processing units (QPUs) in a cleanroom environment.
Role type
Senior IC process engineer (hardware packaging)
Builds
Quantum processing units (QPUs) for quantum computing platforms
Domain
Quantum computing / Microelectronics packaging
Deliverable
production ML models | product features | infrastructure
Required skills
Cleanroom operations, equipment programming, troubleshooting, root cause analysis, operator training, process improvement, recipe development, data-driven experimentation
Preferred skills
Wire bonding, die/flip-chip bonding, solder reflow, epoxy dispense, optical inspection, UHV-compatible assembly, vendor management
Technologies
Wire bonders, die bonders, optical packaging equipment, profilometry/interferometry, plasma cleaning tools
Responsibilities
Operate and improve complex packaging equipment; create and validate equipment recipes; investigate equipment faults and process failures; train and qualify operators; improve yield, throughput, and uptime; support prototype builds from component preparation to release
Seniority
Senior, hands-on IC
