CareerPlan

Senior Packaging Engineer

United States, Washington, RedmondFull-time2026-10-19 → 2026-11-10

Core

Develop and maintain robust assembly processes, test equipment, and advanced packaging technologies for quantum devices.

Role type

Senior IC packaging engineer (quantum devices)

Builds

Packaging solutions and test equipment for quantum devices

Domain

Quantum computing + advanced packaging

Required skills

quantum device assembly, packaging material evaluation, vendor management, cryogenic materials, microwave device packaging, test equipment development, AI tools for performance modeling

Preferred skills

experience managing outside vendors, multi-disciplinary team collaboration

Technologies

cryogenic materials, microwave devices, AI tools

Responsibilities

Develop and maintain assembly processes for quantum devices, drive external packaging material vendors to deliver solutions, evaluate packaging suppliers as scaling partners, implement test equipment for evaluating packaging solutions, support development of advanced packaging technologies

Seniority

Senior, hands-on IC