Staff Process Engineer, Packaging
Core
Operate, program, and troubleshoot cleanroom packaging equipment to build quantum processing units (QPUs).
Role type
Staff Process Engineer (Hardware Packaging)
Builds
Quantum processing units (QPUs) and precision hardware components
Domain
Quantum computing / Microelectronics manufacturing
Required skills
Cleanroom operations, equipment programming, root cause analysis, operator training, process improvement, wire bonding, die/flip-chip bonding
Preferred skills
Microelectronics packaging, solder reflow, optical inspection, UHV-compatible assembly, vendor management
Technologies
Wire bonders, die bonders, optical packaging equipment, plasma cleaning tools, profilometry/interferometry systems
Responsibilities
Operate and troubleshoot complex packaging equipment in cleanroom environments; create and validate equipment recipes; investigate process excursions and implement corrective actions; train and qualify operators on packaging processes; improve yield, throughput, and uptime of packaging workflows; support prototype builds from component preparation to release.
Seniority
Staff, hands-on IC
