Senior Member of Technical Staff (SMTS) – 3D NAND Process Integration
Core
Drive 3D NAND integration and technology roadmap, leading pathfinding and advanced architecture enablement in a cutting-edge R&D environment.
Role type
Senior IC semiconductor process integration engineer (3D NAND)
Builds
Next-generation memory technologies and manufacturable solutions
Domain
Semiconductor manufacturing / 3D NAND memory
Deliverable
production ML models
Required skills
Semiconductor device physics, process integration, experiment design, data analysis, problem-solving, cross-functional collaboration, AI-assisted tooling
Preferred skills
NAND technology development, memory (NAND/DRAM) experience, advanced data analytics, AI/ML techniques
Technologies
AI-enabled data analytics, model-driven methodologies
Responsibilities
Drive 3D NAND integration and technology roadmap; Lead end-to-end development from conception to technology validation; Solve complex integration challenges using data-driven and AI-assisted approaches; Define and optimize module/process architecture; Collaborate across Device, Probe, Test, Design, and Operations teams; Drive technical innovation through process improvements and patents.
Seniority
Senior, hands-on IC