Engineer Packaging Test Engineering
Core
Test engineer supporting electrical test, product characterization, and yield-learning for 2.5D/3D heterogeneous integration technologies including chiplet-based packages, interposers, TSVs, and hybrid bonding.
Role type
IC test engineer (advanced packaging)
Builds
Advanced packaging test vehicles, wafers, dies, and interposers for 2.5D/3D integration
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
electrical test methods, electrical characterization, test hardware qualification, data analysis (Excel/Python/JMP/MATLAB), failure isolation, test coverage correlation, process integration, module coordination
Preferred skills
ATE exposure, wafer probing, package final test, statistics/DOE, advanced packaging awareness, signal/power/thermal integrity
Technologies
2.5D/3D integration, TSV, interposers, hybrid bonding, chiplets, wafer-level testing, package-level testing
Responsibilities
Develop and validate electrical test methods; execute electrical characterization and data collection; define and troubleshoot probe cards and fixtures; analyze test results for yield loss; support failure isolation and root cause verification; assist with test coverage and correlation studies; support process and product qualification; contribute to test automation and standardization; maintain test documentation and procedures.
Seniority
Entry-level, hands-on IC
