Principal Engineer – 3D NAND Process Integration
Core
Drive future 3D NAND technology roadmap and integration by bridging device concepts, materials, and process integration into manufacturable solutions using AI-enabled data analytics.
Role type
Principal Engineer, 3D NAND Process Integration
Builds
Next-generation memory technologies and advanced architecture for future memory nodes
Domain
Semiconductor manufacturing, 3D NAND, Memory
Deliverable
production ML models
Required skills
Semiconductor device physics, Process integration, Memory technology (NAND/DRAM/CMOS), Experiment design, Data analysis, Cross-functional collaboration, Technical innovation
Preferred skills
Advanced data analytics, AI/ML techniques
Technologies
AI-enabled data analytics, Model-driven methodologies
Responsibilities
Drive 3D NAND integration and technology roadmap; Lead end-to-end development from conception to technology validation; Solve complex integration challenges using data-driven and model-based approaches; Define and optimize module/process architecture; Collaborate across full ecosystem (Device, Probe, Test, Design, Operations); Drive technical innovation through process improvements and patents
Seniority
Principal, hands-on IC with strategy & mentorship