Senior Staff Engineer Unit Process Engineering (Wire Bond)
Core
Senior Staff Engineer leading unit process engineering for wire bonding, driving yield, quality, and cost-reduction in semiconductor assembly manufacturing.
Role type
Senior Staff Engineer Unit Process Engineering (Wire Bond)
Builds
Semiconductor power systems and IoT solutions
Domain
Semiconductor manufacturing / Wire bonding
Required skills
Wire bonding process engineering, FOL process engineering, Statistical data analysis, Systematic problem-solving (8D, DMAIC, FTA), Reliability testing (failure modes), Manufacturing process expertise, Equipment knowledge, Technical consultation, Compliance with control plans
Preferred skills
New material qualification, Volume production transition, Yield improvement, Cost-reduction activities, Auditing support
Technologies
Wire bonding equipment, FOL processes, 8D methodology, DMAIC, FTA, Fishbone analysis
Responsibilities
Develop robust processes to drive yield and quality to meet KPIs, Sustain and improve qualified technologies in volume production, Ensure compliance with control plan deployment and quality controls, Support development of new technologies and transition to volume production, Account for driving 8D closure of FAR, MRB, DDM, and SDCAR, Lead yield and quality improvement and cost-reduction activities, Serve as technical expert in new material, process, and method qualification
Seniority
Senior Staff, hands-on IC with team leadership
