Staff Engineer Unit Process Development / Engineering
Core
Lead process metrology, technology development, and manufacturing readiness for advanced semiconductor assembly processes, ensuring quality and reliability for next-generation packages.
Role type
Staff Engineer, Unit Process Development
Builds
Semiconductor assembly processes and packages (Wedge Wire Bond focus)
Domain
Semiconductor manufacturing / Power systems and IoT
Required skills
Process metrology, Automated Optical Inspection (AOI), X-ray inspection, process parameter scouting, process qualification, SPC, DOE, PFMEA, DFMEA, technical documentation, equipment qualification, process optimization
Preferred skills
Semiconductor technology, Microelectronics, Electrical Engineering, Manufacturing Engineering, Automation Engineering
Technologies
AOI, FOL/EOL Auto Vision systems, X-ray inspection, Wedge Wire Bond, SPC, APC, DOE, 8D
Responsibilities
Lead and support Process Metrology activities including AOI, FOL/EOL Auto Vision, and X-ray inspection; Develop and optimize manufacturing processes through parameter scouting and qualification; Define process specifications and controls for Wedge Wire Bond technologies; Drive technical handover to Operations; Support prototype builds and technology qualification; Generate technical documentation (PFMEA, Control Plans, etc.); Collaborate with suppliers to qualify equipment and materials; Participate in problem-solving teams using SPC, DOE, 8D; Identify innovative process technologies; Provide technical mentoring.
Seniority
Staff, hands-on IC with mentorship
