Module Package Technology Development/Definition Senior Staff or Principal Engineer – Based in Taiwan
Core
Develop and define package concepts for AI power-supply products, with an emphasis on high-performance computing (HPC) modules.
Role type
Senior Staff or Principal Engineer, Semiconductor Packaging
Builds
AI power-supply products and HPC modules
Domain
Semiconductor / Power Systems
Deliverable
production ML models
Required skills
Semiconductor packaging, assembly, and test; Back-End processes and materials; Failure analysis and reliability engineering; Statistical analysis (JMP, Minitab); BOM and package design; Assembly technology selection
Preferred skills
SMT and PCB/module technologies; Passive components (MLCCs); AutoCAD and 3D drafting; Market trend monitoring
Technologies
JMP, Minitab, AutoCAD, 3D drafting
Responsibilities
Develop and define package concepts for AI power-supply products; Validate concepts through simulation and hardware demonstrators; Coordinate with Back-End development teams and OSAT partners; Lead technical definition for major/new package projects; Define package characteristics satisfying electrical, thermal, mechanical, and reliability requirements; Serve as technical point of contact for customer questions
Seniority
Senior Staff or Principal Engineer
