Senior Staff Engineer Module Package Development
Core
Develop and define advanced semiconductor packaging solutions for AI power-supply and HPC applications, from concept and validation through product release.
Role type
Senior Staff Engineer, Semiconductor Packaging
Builds
High-performance computing (HPC) modules and AI power-supply products
Domain
Semiconductor manufacturing, Power systems, HPC
Required skills
Semiconductor packaging expertise, Back-End assembly technologies, Failure analysis, Reliability engineering, Statistical analysis (JMP, Minitab), Project lifecycle management, Technical roadmap planning
Preferred skills
AutoCAD, 3D drafting, SMT and PCB/module technologies, Flip/chip process knowledge, Mandarin language
Technologies
JMP, Minitab, AutoCAD, SMT, Flip/chip, Molding
Responsibilities
Develop and define package concepts for AI power-supply and HPC modules, Validate concepts through simulation and hardware demonstrators, Coordinate with Back-End development teams and OSAT partners, Track projects to final product release, Identify emerging development needs and update the package roadmap, Serve as technical point of contact for customer packaging questions, Lead technical definition for major projects including BOM and assembly technology selection, Define package characteristics to satisfy electrical, thermal, mechanical, and reliability requirements
Seniority
Senior Staff, hands-on IC