Engineer Failure Analysis
Core
Perform discrete failure analysis on wafer and package levels to uncover root causes of errors and drive quality improvements in semiconductor products.
Role type
IC failure analysis engineer
Builds
High-reliability semiconductor solutions for power systems and IoT
Domain
Semiconductor manufacturing and device physics
Required skills
Electrical failure verification and fault localization, Sample preparation (wet/dry chemical, cross-sectioning), Defect imaging (Optical Microscopy, SEM, FIB), Semiconductor manufacturing processes knowledge, Device physics knowledge, Fault Tree Analysis
Technologies
OBIRCH, TIVA, SEI, I-V characterization, SEM, FIB, Voltage Contrast
Responsibilities
Perform discrete failure analysis on wafer and package levels, Prepare FA reports for root cause finding, Own FA equipment/tools, Interface with cross-functional teams, Achieve EFA KPIs, Conduct Fault Tree Analysis when no physical defect is found
Seniority
Mid-level IC
