Junior Failure Analysis Engineer
Core
Hands-on technical problem solving for root cause analysis of device failures in Logic, Mixed Signal, Power ICs, Discrete, Interface, RF Power & Optoelectronic devices.
Role type
Junior Failure Analysis Engineer
Builds
Product Analysis Reports and corrective action recommendations for internal engineering, manufacturing, and customers
Domain
Semiconductor manufacturing and device physics
Required skills
Semiconductor physics, MOS & bipolar junction transistor theory, analog & logic circuit understanding, wafer fab/assembly/test knowledge, deprocessing techniques, analytical microscopy (SEM, FIB, CLSM, EMMI, TIVA, EDX), electrical bench verification, fault isolation, data entry
Preferred skills
Advanced circuit failure analysis methods, benchmarking FA methods against other manufacturers, training others in physics of failure
Technologies
Parametric analyzers, curve tracers, oscilloscopes, Scanning Electron Microscopes (SEM), Focus Ion Beam (FIB), Confocal Laser Scanning Microscope (CLSM), Photon Emission Microscopy (EMMI), Thermal Induced Voltage Alterations (TIVA), Energy Dispersive X-rays (EDX), Windows, Excel, PowerPoint
Responsibilities
Perform failure analysis on wafer fabrication, package assembly, reliability stress test, qualification, customer returns, and new product/process introduction failures; utilize electrical bench verification and non-destructive analysis; generate high-quality Product Analysis Reports; drive quality improvement and provide corrective action recommendations; train others in physics of failure and analytical techniques; enter data into database and oversee case activity
Seniority
Entry Level, hands-on IC