ENGR II, FAILURE ANALYSIS; QUAL&REL
Core
Perform detailed failure investigations and root cause analyses on discrete, analog, and power module products to support customers, Reliability teams, New Product Development, and Production.
Role type
Failure Analysis Engineer
Builds
Product improvement, yield enhancement, and customer satisfaction
Domain
Semiconductor manufacturing and reliability engineering
Required skills
electrical characterization, physical inspection, cross-sectioning, SEM/EDX analysis, X-ray analysis, curve tracing, optical microscopy, chemical decapsulation, semiconductor device physics knowledge, IC fabrication process knowledge, IC design knowledge
Preferred skills
1-2 years of failure analysis experience, strong lab experience, ability to work in shifts
Technologies
SEM, EDX, X-ray, curve tracer, optical microscopy, chemical decapsulation
Responsibilities
Perform electrical and physical failure analysis on semiconductor devices and power modules, Use tools such as SEM/EDX, X-ray, curve tracer, optical microscopy, cross-sectioning, and chemical decapsulation, Document findings in detailed reports and present results to internal teams and customers, Collaborate with cross-functional teams including Reliability, Product Development, and Manufacturing, Support customer returns and field failure investigations (EFAR), Drive continuous improvement in failure analysis methodologies and lab capabilities, Maintain lab equipment and ensure compliance with safety and quality standards
Seniority
Junior to Mid-level, hands-on IC