TECHNICIAN 3, FAILURE ANALYSIS
Core
Perform detailed failure investigations and root cause analyses on discrete, analog, and power module semiconductor products to identify failure mechanisms and support product improvement.
Role type
Failure Analysis Technician
Builds
Semiconductor devices and modules
Domain
Semiconductor manufacturing and reliability engineering
Required skills
electrical characterization, physical inspection, cross-sectioning, SEM/EDX analysis, sample preparation (decapsulation, polishing), laboratory equipment operation, technical reporting, root cause investigation support, laboratory logistics management, ESD compliance
Preferred skills
familiarity with semiconductor device structures, understanding of failure mechanisms, experience with hazardous materials handling, shift work flexibility
Technologies
SEM, EDX, X-ray, curve tracer, optical microscopy, chemical decapsulation equipment
Responsibilities
Perform electrical and physical failure analysis on semiconductor devices; Operate and maintain FA equipment; Prepare samples for analysis through decapsulation and cross-sectioning; Document analysis findings in technical reports; Assist FA engineers in root cause investigations; Manage sample flow and laboratory logistics; Maintain laboratory equipment and work areas; Ensure compliance with safety, quality, and ESD requirements
Seniority
Junior to Mid-level, hands-on IC