Engineer Unit Process Engineering
Core
Provide daily process and quality engineering support to production, driving yield enhancement and continuous quality improvement initiatives.
Role type
Unit Process Engineer (Wire Bond)
Builds
Semiconductor power systems and IoT solutions
Domain
Semiconductor manufacturing (Wire Bonding)
Required skills
wire bond process expertise (Au wire), analytical thinking, problem-solving, lot investigation and disposition, yield improvement, process optimization
Preferred skills
knowledge in NLOP and NLOZD projects
Technologies
Au wire bonding equipment
Responsibilities
Perform daily support to production for quality and process engineering topics, lead lot investigations and disposition activities, resolve manufacturing issues, drive yield improvement initiatives, participate in NLOP and NLOZD projects
Seniority
Entry-level to Mid-level, hands-on IC