Senior Engineer Unit Process Engineering Soldering
Core
Control soldering processes, analyze production abnormalities, and drive yield/quality improvements in semiconductor backend packaging.
Role type
Senior IC process engineer (soldering)
Builds
Semiconductor power systems and IoT components
Domain
Semiconductor manufacturing (backend packaging)
Required skills
Soldering process expertise, Statistical Process Control (SPC), Root cause analysis (8D, 5Why, 7 QC tools), FMEA, DOE, MSA, Yield improvement, Data-driven troubleshooting
Preferred skills
Cross-functional collaboration, Technical training and mentoring
Technologies
SPC, FMEA, 8D, 5Why, 7 QC Tools, DOE, MSA
Responsibilities
Monitor process performance via statistical data, Manage DDM deviation and defect handling, Review and maintain process documents (FMEA, chipsheet, OJTI, GCM), Optimize process parameters and drive continuous yield improvement, Implement safe launch management for new products, Conduct internal technical training and mentoring
Seniority
Senior, hands-on IC