Internship – Package & Process Engineer
Core
Assist with the design and development of HiRel application packages, support process development activities, and ensure compliance with quality standards in packaging development.
Role type
Internship – Package & Process Engineer
Builds
HiRel application packages and robust manufacturing workflows
Domain
Semiconductor manufacturing / High-reliability packaging
Required skills
CAD software (SolidWorks, AutoCAD), 3D modeling, material properties and selection, quality control processes, problem-solving, troubleshooting
Preferred skills
Mechanical Engineering, Materials Science, Chemical Engineering background
Technologies
SolidWorks, AutoCAD, CAD software
Responsibilities
Assist with the design and development of HiRel application packages; Support process development activities to ensure robust manufacturing workflows; Understand and ensure compliance with quality standards in packaging development; Utilize CAD software and 3D modeling tools to create packaging solutions; Work with cross-functional teams to drive packaging activities and achieve project goals; Ensure all safety requirements and protocols are followed during project execution
Seniority
Internship, junior level