Engineer , Pkg Reliability
Core
Ensure quality and reliability of semiconductor packages across product lines by coordinating qualification activities, executing reliability tests, and driving root cause analysis for failures.
Role type
Package Reliability Engineer
Builds
Semiconductor memory and storage products (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing / Micro Electronic Packaging
Required skills
Semiconductor package assembly processes, Surface mount technology, Thermo-mechanical and material interactions, Reliability test methods, Life prediction acceleration models, Statistical sampling, 8D problem-solving, SPC, FMEA, Backend manufacturing software systems
Preferred skills
AI-assisted tools integration, Continuous improvement methodologies
Technologies
SPC, FMEA, 8D CAR, Backend manufacturing software systems
Responsibilities
Lead and coordinate package qualification efforts for new products and process introductions; Develop and implement robust qualification plans for new technologies; Execute reliability test plans to evaluate risks associated with excursions and conversions; Participate in 8D problem-solving processes for qualification failures and customer RMAs; Serve as technical liaison for internal teams and external customers regarding quality and reliability concerns.
Seniority
Entry-level (0-1 year experience)
