Staff Engineer Unit Process Development Wire Bond
Core
Develop and qualify wire bonding processes for semiconductor assembly, ensuring manufacturability and supporting new product introductions.
Role type
Staff Engineer, Unit Process Development (Wire Bond)
Builds
Semiconductor power systems and IoT components
Domain
Semiconductor manufacturing / Assembly process development
Required skills
Wire bonding process development, Root cause analysis (DMAIC, 8D, FMEA), Statistical data analysis, Design of Experiments (DOE), Failure analysis, Process documentation (PFMEA, DFMEA, OJTI), Equipment qualification
Preferred skills
Experience with ASM and Shinkawa equipment platforms, Cross-functional collaboration
Technologies
ASM, Shinkawa, T32 equipment
Responsibilities
Serve as unit process expert for development projects and milestone achievement, Lead qualification and verification of new materials, tooling, and equipment, Support prototype and customer sample builds with process optimization, Own and maintain process documentation, Ensure technical handover to Operations, Collaborate with cross-functional teams and suppliers
Seniority
Senior, hands-on IC